Electrical ground looks simple on a schematic; unfortunately, the actual performance of a circuit is dictated by its layout （and by its printed-circuit-board）. When the ground node moves, system performance suffers ...Electrical ground looks simple on a schematic; unfortunately, the actual performance of a circuit is dictated by its layout （and by its printed-circuit-board）. When the ground node moves, system performance suffers and the system radiates electromagnetic interferences. But the understanding of the physics of ground noise can provide an intuitive sense for reducing the problem. Ground bounce can produce transients with amplitudes of volts; most often changing magnetic flux is the cause; in this work, the authors use a Finite-Difference Time-Domain to begin to understand such phenomena. Additionally, predicting substrate cross-talks in mixed-signal circuits has become a critical issue to preserve signal integrity in future integrated systems. Phenomena that involve parasitic signal propagation into the substrate are discussed. A simple methodology to predict the substrate cross-talk and some associated tools are presented. Finally, the authors indicate a stochastic method which could grasp both outer or inner RF （Radio-Frequency） radiations and substrate parasites.展开更多
The authors state briefly the possibility of various simulators to handle propagation of electromagnetic waves along some interconnections, in 3D RF （Radio Frequency） circuits. The studies are first derived in the t...The authors state briefly the possibility of various simulators to handle propagation of electromagnetic waves along some interconnections, in 3D RF （Radio Frequency） circuits. The studies are first derived in the time domain： a Finite-Difference Time-Domain method is applied, taking spectra via FFTs （Fast Fourier Transform） as post-processors. Electric and magnetic field distributions, pulse propagations along stripline structures or vias are highlighted. The scattering parameters for various cases are extracted and compared. Some original issue of this work is an insight on crosstalk or shielding phenomena between lines.展开更多
3D chip stacking is considered known to overcome conventional 2D-IC issues, using through silicon vias to ensure vertical signal transmission. From any point source, embedded or not, we calculate the impedance spread ...3D chip stacking is considered known to overcome conventional 2D-IC issues, using through silicon vias to ensure vertical signal transmission. From any point source, embedded or not, we calculate the impedance spread out;our ultimate goal will to study substrate noise via impedance field method. For this, our approach is twofold: a compact Green function or a Transmission Line Model over a multi-layered substrate is derived by solving Poisson’s equation analytically. The Discrete Cosine Transform (DCT) and its variations are used for rapid evaluation. Using this technique, the substrate coupling and loss in IC’s can be analyzed. We implement our algorithm in MATLAB;it permits to extract impedances between any pair of embedded contacts. Comparisons are performed using finite element methods.展开更多
文摘Electrical ground looks simple on a schematic; unfortunately, the actual performance of a circuit is dictated by its layout （and by its printed-circuit-board）. When the ground node moves, system performance suffers and the system radiates electromagnetic interferences. But the understanding of the physics of ground noise can provide an intuitive sense for reducing the problem. Ground bounce can produce transients with amplitudes of volts; most often changing magnetic flux is the cause; in this work, the authors use a Finite-Difference Time-Domain to begin to understand such phenomena. Additionally, predicting substrate cross-talks in mixed-signal circuits has become a critical issue to preserve signal integrity in future integrated systems. Phenomena that involve parasitic signal propagation into the substrate are discussed. A simple methodology to predict the substrate cross-talk and some associated tools are presented. Finally, the authors indicate a stochastic method which could grasp both outer or inner RF （Radio-Frequency） radiations and substrate parasites.
文摘The authors state briefly the possibility of various simulators to handle propagation of electromagnetic waves along some interconnections, in 3D RF （Radio Frequency） circuits. The studies are first derived in the time domain： a Finite-Difference Time-Domain method is applied, taking spectra via FFTs （Fast Fourier Transform） as post-processors. Electric and magnetic field distributions, pulse propagations along stripline structures or vias are highlighted. The scattering parameters for various cases are extracted and compared. Some original issue of this work is an insight on crosstalk or shielding phenomena between lines.
文摘3D chip stacking is considered known to overcome conventional 2D-IC issues, using through silicon vias to ensure vertical signal transmission. From any point source, embedded or not, we calculate the impedance spread out;our ultimate goal will to study substrate noise via impedance field method. For this, our approach is twofold: a compact Green function or a Transmission Line Model over a multi-layered substrate is derived by solving Poisson’s equation analytically. The Discrete Cosine Transform (DCT) and its variations are used for rapid evaluation. Using this technique, the substrate coupling and loss in IC’s can be analyzed. We implement our algorithm in MATLAB;it permits to extract impedances between any pair of embedded contacts. Comparisons are performed using finite element methods.
