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Fabrication of 3D air-core MEMS inductors for very-highfrequency power conversions 被引量:4
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作者 Hoa Thanh Le Io Mizushima +5 位作者 Yasser Nour Peter Torben Tang Arnold Knott Ziwei Ouyang flemming jensen Anpan Han 《Microsystems & Nanoengineering》 EI CSCD 2018年第1期509-517,共9页
We report a fabrication technology for 3D air-core inductors for small footprint and very-high-frequency power conversions.Our process is scalable and highly generic for fabricating inductors with a wide range of geom... We report a fabrication technology for 3D air-core inductors for small footprint and very-high-frequency power conversions.Our process is scalable and highly generic for fabricating inductors with a wide range of geometries and core shapes.We demonstrate spiral,solenoid,and toroidal inductors,a toroidal transformer and inductor with advanced geometries that cannot be produced by wire winding technology.The inductors are embedded in a silicon substrate and consist of through-silicon vias and suspended windings.The inductors fabricated with 20 and 25 turns and 280-350μm heights on 4-16 mm2 footprints have an inductance from 34.2 to 44.6 nH and a quality factor from 10 to 13 at frequencies ranging from 30 to 72 MHz.The air-core inductors show threefold lower parasitic capacitance and up to a 140% higher-quality factor and a 230% higher-operation frequency than silicon-core inductors.A 33 MHz boost converter mounted with an air-core toroidal inductor achieves an efficiency of 68.2%,which is better than converters mounted with a Si-core inductor(64.1%).Our inductors show good thermal cycling stability,and they are mechanically stable after vibration and 2-m-drop tests. 展开更多
关键词 MEMS inductor PwrSoC TSVs very high frequency 3D
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