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氨基甲基吡啶改性氮化硼/线型低密度聚乙烯复合材料的热性能及力学性能 被引量:3
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作者 唐敢 柯雪 +5 位作者 董姗 张兆阳 游峰 陈蓉 刘仿军 江学良 《高分子材料科学与工程》 EI CAS CSCD 北大核心 2023年第2期43-50,共8页
利用4-氨基甲基吡啶与马来酸酐接枝线型低密度聚乙烯(LLDPE-g-MAH)成功制备了氨基甲基吡啶接枝线型低密度聚乙烯(LLDPE-g-Py),然后采用熔融共混法制备了改性的BN/LLDPE(mBN/LLDPE)复合材料。深入研究了mBN/LLDPE复合材料的热性能和力学... 利用4-氨基甲基吡啶与马来酸酐接枝线型低密度聚乙烯(LLDPE-g-MAH)成功制备了氨基甲基吡啶接枝线型低密度聚乙烯(LLDPE-g-Py),然后采用熔融共混法制备了改性的BN/LLDPE(mBN/LLDPE)复合材料。深入研究了mBN/LLDPE复合材料的热性能和力学性能等。结果表明,LLDPE-g-Py的加入,使mBN/LLDPE复合材料的导热性能得到很大提升,但LLDPE-g-Py过多会导致其耐热性降低。为了改善复合材料的耐热性,将LLDPE-g-Py质量分数固定为10%。当BN质量分数为40%时,mBN/LLDPE复合材料的导热系数达到了0.95 W/(m·K),为纯LLDPE导热系数(0.32 W/(m·K))的3倍。同时,mBN/LLDPE复合材料的拉伸强度在小幅度下降的情况下,其断裂伸长率得到明显的改善。 展开更多
关键词 复合材料 线型低密度聚乙烯 氮化硼 导热性 力学性能
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Research on electromagnetic interference resistance performance of three kinds of CMOS inverters
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作者 fangjun liu Jiaming SHEN Jizhong SHEN 《Frontiers of Information Technology & Electronic Engineering》 SCIE EI CSCD 2024年第10期1390-1405,共16页
The performance of complementary metal oxide semiconductor(CMOS)circuits is affected by electromagnetic interference(EMI),and the study of the circuit's ability to resist EMI will facilitate the design of circuits... The performance of complementary metal oxide semiconductor(CMOS)circuits is affected by electromagnetic interference(EMI),and the study of the circuit's ability to resist EMI will facilitate the design of circuits with better performance.Current-mode CMOS circuits have been continuously developed in recent years due to their advantages of high speed and low power consumption over conventional circuits under the deep submicron process;their EMI resistance performance deserves further study.This paper introduces three kinds of NOT gate circuits:conventional voltage-mode CMOS,MOS current-mode logic(MCML)with voltage signal of input and output,and current-mode CMOS with current signal of input and output.The effects of EMI on three NOT gate circuits are investigated using Cadence Virtuoso software simulation,and a disturbance level factor is defined to compare the effects of different interference terminals,interference signals'waveforms,and interference signals'frequencies on the circuits in the 65 nm process.The relationship between input resistance and circuit EMI resistance performance is investigated by varying the value of cascade resistance at the input of the current-mode CMOS circuits.Simulation results show that the current-mode CMOS circuits have better resistance performance to EMI at high operating frequencies,and the higher the operating frequency of the current-mode CMOS circuits,the better the resistance performance of the circuits to EMI.Additionally,the effects of different temperatures and different processes on the resistance performance of three circuits are also studied.In the temperature range of-40℃to 125℃,the higher the temperature,the weaker the resistance ability of voltage-mode CMOS and MCML circuits,and the stronger the resistance ability of current-mode CMOS circuits.In the 28 nm process,the current-mode CMOS circuit interference resistance ability is relatively stronger than that of the other two kinds of circuits.The relative interference resistance ability of voltage-mode CMOS and MCML circuits in the 28 nm process is similar to that of the 65 nm process,while the relative interference resistance ability of current-mode CMOS circuits in the 28 nm process is stronger than that of the 65 nm process.This study provides a basis for the design of current-mode CMOS circuits against EMI. 展开更多
关键词 Voltage-mode complementary metal oxide semiconductor(CMOS) MOS current-mode logic(MCML) Current-mode CMOS Electromagnetic interference(EMI) INVERTER
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