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Simulation on Grain Boundary Sliding during Superplastic Deformation Using Molecular Dynamics Method
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作者 JitaiNIU LihongHAN chonghaowoo 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2003年第2期177-179,共3页
Grain growth and grain boundary sliding are the two main superplastic deformation mechanisms. In the paper, simulation work is focused on the sliding of a S3 (111) symmetric twist coincidence grain boundary, a S13 (11... Grain growth and grain boundary sliding are the two main superplastic deformation mechanisms. In the paper, simulation work is focused on the sliding of a S3 (111) symmetric twist coincidence grain boundary, a S13 (110) asymmetric tilt coincidence grain boundary, and a S3 (110) symmetric tilt coincidence grain boundary in Al, and the energies of grain boundary for each of equilibrium configurations are computed. An embedded atom method (EAM) potential was used to simulate the atomic interactions in a bicrystal containing more than 2000 atoms. At 0 K, the relationships between total potential energy and time steps for S3 (111) symmetric twist coincidence grain boundary and S3 (110) symmetric tilt coincidence grain boundary during sliding at 2 m/s represent the periodic characteristic. However, the relationship between total potential energy and time steps for S13 (110) asymmetric tilt coincidence grain boundary represents the damp surge characteristic. It is found that grain boundary sliding for S3 (110) symmetric tilt coincidence grain boundary is coupled with apparent grain boundary migration. 展开更多
关键词 ALUMINUM Grain boundary sliding Superplastic deformation MD simulation
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