Articular cartilage damage caused by trauma or degenerative diseases such as osteoarthritis remains a major therapeutic challenge due to the tissue’s limited regenerative capacity.Traditional surgical interventions-i...Articular cartilage damage caused by trauma or degenerative diseases such as osteoarthritis remains a major therapeutic challenge due to the tissue’s limited regenerative capacity.Traditional surgical interventions-including microfracture,autologous chondrocyte implantation,and osteochondral grafting-often result in the formation of biomechanically inferior fibrocartilage and fail to restore longterm joint function.In contrast,stem cell-based strategies have emerged as a promising approach for regenerating hyaline-like cartilage by combining the biological potential of mesenchymal stem cells and induced pluripotent stem cells with advances in tissue engineering.This review synthesizes the current understanding of cartilage structure and repair limitations,evaluates the regenerative potential of various stem cell sources,and highlights engineering innovations such as bioactive scaffolds,controlled growth factor delivery,and threedimensional bioprinting.We also examine key preclinical studies and early-phase clinical trials demonstrating the safety and efficacy of stem cell-based therapies.Finally,we explore future directions,including gene editing,exosome-based therapeutics,and personalized regenerative strategies,that may address remaining translational barriers.Collectively,stem cell-centered approaches offer a transformative avenue toward durable,functional cartilage repair and hold strong potential for clinical application.展开更多
In three-dimensional(3D)stacking,the thermal stress of through-silicon via(TSV)has a significant influence on chip performance and reliability,and this problem is exacerbated in high-density TSV arrays.In this study,a...In three-dimensional(3D)stacking,the thermal stress of through-silicon via(TSV)has a significant influence on chip performance and reliability,and this problem is exacerbated in high-density TSV arrays.In this study,a novel hollow tungsten TSV(W-TSV)is presented and developed.The hollow structure provides space for the release of thermal stress.Simulation results showed that the hollow W-TSV structure can release 60.3%of thermal stress within the top 2 lm from the surface,and thermal stress can be decreased to less than 20 MPa in the radial area of 3 lm.The ultra-high-density(1600 TSV∙mm2)TSV array with a size of 640×512,a pitch of 25 lm,and an aspect ratio of 20.3 was fabricated,and the test results demonstrated that the proposed TSV has excellent electrical and reliability performances.The average resistance of the TSV was 1.21 X.The leakage current was 643 pA and the breakdown voltage was greater than 100 V.The resistance change is less than 2%after 100 temperature cycles from40 to 125℃.Raman spectroscopy showed that the maximum stress on the wafer surface caused by the hollow W-TSV was 31.02 MPa,which means that there was no keep-out zone(KOZ)caused by the TSV array.These results indicate that this structure has great potential for applications in large-array photodetectors and 3D integrated circuits.展开更多
In this paper, AuNRs colloids with SPRL located at ~810 nm and ~1100 nm were synthesized using an improved seed method. Based on the NIR lasers available, photothermal conversion of AuNRs were systematically studied c...In this paper, AuNRs colloids with SPRL located at ~810 nm and ~1100 nm were synthesized using an improved seed method. Based on the NIR lasers available, photothermal conversion of AuNRs were systematically studied compared with that of water. Under low power irradiation, the highest temperature is obtained when the SPRL wavelength of AuNRs is equal to the laser wavelength, and temperature of colloid increases from ~20°C to ~65°C. With increasing laser power (such as 6 W), the AuNRs colloid boils within a few minutes, and nanorods undergo a shape deformation from rod to spherical particle and even fusion, and the SPRL disappears. For further investigation, the obtained AuNRs were coated with SiO2 shell to form a core-shell nanostructure (Au@SiO2). The surface coating can be used not only in keeping the stability of AuNRs for further treatment, but also in increasing plasmonic property and biocompatibility. This work will be useful for designing plasmonic photothermal properties and further applications in nanomedicine.展开更多
基金Supported by Yantai Science and Technology Innovation Development Plan Project,No.2023YD048.
文摘Articular cartilage damage caused by trauma or degenerative diseases such as osteoarthritis remains a major therapeutic challenge due to the tissue’s limited regenerative capacity.Traditional surgical interventions-including microfracture,autologous chondrocyte implantation,and osteochondral grafting-often result in the formation of biomechanically inferior fibrocartilage and fail to restore longterm joint function.In contrast,stem cell-based strategies have emerged as a promising approach for regenerating hyaline-like cartilage by combining the biological potential of mesenchymal stem cells and induced pluripotent stem cells with advances in tissue engineering.This review synthesizes the current understanding of cartilage structure and repair limitations,evaluates the regenerative potential of various stem cell sources,and highlights engineering innovations such as bioactive scaffolds,controlled growth factor delivery,and threedimensional bioprinting.We also examine key preclinical studies and early-phase clinical trials demonstrating the safety and efficacy of stem cell-based therapies.Finally,we explore future directions,including gene editing,exosome-based therapeutics,and personalized regenerative strategies,that may address remaining translational barriers.Collectively,stem cell-centered approaches offer a transformative avenue toward durable,functional cartilage repair and hold strong potential for clinical application.
基金supported by the National Key Research and Development Program of China(2021YFB2011700).
文摘In three-dimensional(3D)stacking,the thermal stress of through-silicon via(TSV)has a significant influence on chip performance and reliability,and this problem is exacerbated in high-density TSV arrays.In this study,a novel hollow tungsten TSV(W-TSV)is presented and developed.The hollow structure provides space for the release of thermal stress.Simulation results showed that the hollow W-TSV structure can release 60.3%of thermal stress within the top 2 lm from the surface,and thermal stress can be decreased to less than 20 MPa in the radial area of 3 lm.The ultra-high-density(1600 TSV∙mm2)TSV array with a size of 640×512,a pitch of 25 lm,and an aspect ratio of 20.3 was fabricated,and the test results demonstrated that the proposed TSV has excellent electrical and reliability performances.The average resistance of the TSV was 1.21 X.The leakage current was 643 pA and the breakdown voltage was greater than 100 V.The resistance change is less than 2%after 100 temperature cycles from40 to 125℃.Raman spectroscopy showed that the maximum stress on the wafer surface caused by the hollow W-TSV was 31.02 MPa,which means that there was no keep-out zone(KOZ)caused by the TSV array.These results indicate that this structure has great potential for applications in large-array photodetectors and 3D integrated circuits.
文摘In this paper, AuNRs colloids with SPRL located at ~810 nm and ~1100 nm were synthesized using an improved seed method. Based on the NIR lasers available, photothermal conversion of AuNRs were systematically studied compared with that of water. Under low power irradiation, the highest temperature is obtained when the SPRL wavelength of AuNRs is equal to the laser wavelength, and temperature of colloid increases from ~20°C to ~65°C. With increasing laser power (such as 6 W), the AuNRs colloid boils within a few minutes, and nanorods undergo a shape deformation from rod to spherical particle and even fusion, and the SPRL disappears. For further investigation, the obtained AuNRs were coated with SiO2 shell to form a core-shell nanostructure (Au@SiO2). The surface coating can be used not only in keeping the stability of AuNRs for further treatment, but also in increasing plasmonic property and biocompatibility. This work will be useful for designing plasmonic photothermal properties and further applications in nanomedicine.
