The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical ...The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical quantities,ICs typically provide functionalities related to the signals of these transducers,such as analog-to-digital conversion,amplification,filtering and information processing as well as communication between the MEMS transducer and the outside world.Thus,the vast majority of commercial MEMS products,such as accelerometers,gyroscopes and micro-mirror arrays,are integrated and packaged together with ICs.There are a variety of possible methods of integrating and packaging MEMS and IC components,and the technology of choice strongly depends on the device,the field of application and the commercial requirements.In this review paper,traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed.These include approaches based on the hybrid integration of multiple chips(multi-chip solutions)as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques.These are important technological building blocks for the‘More-Than-Moore’paradigm described in the International Technology Roadmap for Semiconductors.In this paper,the various approaches are categorized in a coherent manner,their merits are discussed,and suitable application areas and implementations are critically investigated.The implications of the different MEMS and IC integration approaches for packaging,testing and final system costs are reviewed.展开更多
Graphene’s unparalleled strength,chemical stability,ultimate surface-to-volume ratio and excellent electronic properties make it an ideal candidate as a material for membranes in micro-and nanoelectromechanical syste...Graphene’s unparalleled strength,chemical stability,ultimate surface-to-volume ratio and excellent electronic properties make it an ideal candidate as a material for membranes in micro-and nanoelectromechanical systems(MEMS and NEMS).However,the integration of graphene into MEMS or NEMS devices and suspended structures such as proof masses on graphene membranes raises several technological challenges,including collapse and rupture of the graphene.We have developed a robust route for realizing membranes made of double-layer CVD graphene and suspending large silicon proof masses on membranes with high yields.We have demonstrated the manufacture of square graphene membranes with side lengths from 7µm to 110µm,and suspended proof masses consisting of solid silicon cubes that are from 5µm×5µm×16.4µm to 100µm×100µm×16.4µm in size.Our approach is compatible with wafer-scale MEMS and semiconductor manufacturing technologies,and the manufacturing yields of the graphene membranes with suspended proof masses were>90%,with>70%of the graphene membranes having>90%graphene area without visible defects.The measured resonance frequencies of the realized structures ranged from tens to hundreds of kHz,with quality factors ranging from 63 to 148.The graphene membranes with suspended proof masses were extremely robust,and were able to withstand indentation forces from an atomic force microscope(AFM)tip of up to~7000nN.The proposed approach for the reliable and large-scale manufacture of graphene membranes with suspended proof masses will enable the development and study of innovative NEMS devices with new functionalities and improved performances.展开更多
基金The work was partially funded by the Swedish Research Council,by the European 7^(th)Framework Programme under grant agreement FP7-NEMIAC(No.288670)by the European Research Council through the ERC Advanced Grant xMEMs(No.267528)and the ERC Starting Grant M&M’s(No.277879).
文摘The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical quantities,ICs typically provide functionalities related to the signals of these transducers,such as analog-to-digital conversion,amplification,filtering and information processing as well as communication between the MEMS transducer and the outside world.Thus,the vast majority of commercial MEMS products,such as accelerometers,gyroscopes and micro-mirror arrays,are integrated and packaged together with ICs.There are a variety of possible methods of integrating and packaging MEMS and IC components,and the technology of choice strongly depends on the device,the field of application and the commercial requirements.In this review paper,traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed.These include approaches based on the hybrid integration of multiple chips(multi-chip solutions)as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques.These are important technological building blocks for the‘More-Than-Moore’paradigm described in the International Technology Roadmap for Semiconductors.In this paper,the various approaches are categorized in a coherent manner,their merits are discussed,and suitable application areas and implementations are critically investigated.The implications of the different MEMS and IC integration approaches for packaging,testing and final system costs are reviewed.
基金We acknowledge support through a scholarship from China Scholarship Council,the Starting Grants M&M’s(277879)and InteGraDe(307311)as well as Graphene Flagship(785219)from the European Research Council,the Swedish Research Council(GEMS,2015-05112)+2 种基金the German Federal Ministry for Education and Research(NanoGraM,BMBF,03XP0006C)the German Research Foundation(DFG,LE 2440/1-2)the German Federal Ministry for Education and Research(BMBF:NanoGraM,03XP0006 and GIMMIK,03XP0210)。
文摘Graphene’s unparalleled strength,chemical stability,ultimate surface-to-volume ratio and excellent electronic properties make it an ideal candidate as a material for membranes in micro-and nanoelectromechanical systems(MEMS and NEMS).However,the integration of graphene into MEMS or NEMS devices and suspended structures such as proof masses on graphene membranes raises several technological challenges,including collapse and rupture of the graphene.We have developed a robust route for realizing membranes made of double-layer CVD graphene and suspending large silicon proof masses on membranes with high yields.We have demonstrated the manufacture of square graphene membranes with side lengths from 7µm to 110µm,and suspended proof masses consisting of solid silicon cubes that are from 5µm×5µm×16.4µm to 100µm×100µm×16.4µm in size.Our approach is compatible with wafer-scale MEMS and semiconductor manufacturing technologies,and the manufacturing yields of the graphene membranes with suspended proof masses were>90%,with>70%of the graphene membranes having>90%graphene area without visible defects.The measured resonance frequencies of the realized structures ranged from tens to hundreds of kHz,with quality factors ranging from 63 to 148.The graphene membranes with suspended proof masses were extremely robust,and were able to withstand indentation forces from an atomic force microscope(AFM)tip of up to~7000nN.The proposed approach for the reliable and large-scale manufacture of graphene membranes with suspended proof masses will enable the development and study of innovative NEMS devices with new functionalities and improved performances.
