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Microstructure and penetration behavior of electroformed copper liners of shaped charges during explosive detonation deformation 被引量:4
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作者 ailing fan Wenhuai Tian +1 位作者 Qi Sun Baoshen Wang 《Journal of University of Science and Technology Beijing》 CSCD 2006年第1期73-77,共5页
The microstructure in the electroformed copper liners of shaped charges prepared with different electrolytes was studied by Scanning Electron Microscopy (SEM) and Electron Backscattering Kikuchi Pattern (EBSP) met... The microstructure in the electroformed copper liners of shaped charges prepared with different electrolytes was studied by Scanning Electron Microscopy (SEM) and Electron Backscattering Kikuchi Pattern (EBSP) methods. SEM observations revealed the existence of columnar grains in electroformed copper liners of shaped charges formed by electrolyte without any additive and the average grain size is about 3 μm. When an additive is introduced to the electrolyte, the grains formed in the copper liners become equiaxed and finer. EBSP results show that the columnar grain grown during electroformation has the most preferential growth direction, whereas a micro-texture does not exit in the specimen prepared by electrolyte with the additive. Further, explosive detonation deformation experiments show that penetration depth is dramatically improved when the electroformed copper liners of shaped charges exhibit equiaxed grains. 展开更多
关键词 ELECTROFORMATION additive MICROSTRUCTURE explosive detonation deformation PENETRATION
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