The effect of the pore density of porous copper(Cu)on brazed Cu/porous Cu was investigated.A filler with a composition of Cu⁃9.0Sn⁃7.0Ni⁃6.0P(Sn:Tin;Ni:Nickel;P:Phosphorus)and porous Cu with pore densities of 15 pores...The effect of the pore density of porous copper(Cu)on brazed Cu/porous Cu was investigated.A filler with a composition of Cu⁃9.0Sn⁃7.0Ni⁃6.0P(Sn:Tin;Ni:Nickel;P:Phosphorus)and porous Cu with pore densities of 15 pores per inch(PPI),25 PPI,and 50 PPI were employed.The joint strength of Cu/porous Cu was evaluated with shear tests at different brazing temperatures.Characterizations of the joint interface and fractured surface were achieved with scanning electron microscope(SEM),energy dispersive X⁃ray spectroscopy(EDX),and X⁃ray diffraction(XRD).The micro⁃hardness test of Cu/porous Cu joint interface showed a high hardness value(HV)for 50 PPI porous Cu.This result was in line with its low shear strength.It was proved that the joint strength of Cu/porous Cu is dependent on the pore density of the porous Cu structure and brittle phases of Cu_(3)P and Ni_(3)P in the brazed interface.展开更多
基金Sponsored by the Fundamental Research Grant Scheme,FRGS University of Malaya(Grant No.FP062-2015A)the Research Universities,RU University of Malaya(Grant No.ST006-2018).
文摘The effect of the pore density of porous copper(Cu)on brazed Cu/porous Cu was investigated.A filler with a composition of Cu⁃9.0Sn⁃7.0Ni⁃6.0P(Sn:Tin;Ni:Nickel;P:Phosphorus)and porous Cu with pore densities of 15 pores per inch(PPI),25 PPI,and 50 PPI were employed.The joint strength of Cu/porous Cu was evaluated with shear tests at different brazing temperatures.Characterizations of the joint interface and fractured surface were achieved with scanning electron microscope(SEM),energy dispersive X⁃ray spectroscopy(EDX),and X⁃ray diffraction(XRD).The micro⁃hardness test of Cu/porous Cu joint interface showed a high hardness value(HV)for 50 PPI porous Cu.This result was in line with its low shear strength.It was proved that the joint strength of Cu/porous Cu is dependent on the pore density of the porous Cu structure and brittle phases of Cu_(3)P and Ni_(3)P in the brazed interface.
