摘要
JISZ3198是关于无铅钎料及其接合部性能测试的工业标准,由日本焊接协会提出初始提案,经日本工业标准调查会审议,最终由日本经济产业省于2003年6月20日并发布。标准涵盖了无铅钎料熔化温度范围测试、机械特性测试、铺展性测试、润湿性测试、接头的拉伸与剪切强度测试、QFP引线软钎焊接头拉引测试、片式元件软钎焊接头的剪切测试7个方面。依据JISZ31981-7原文对该标准各部分进行介绍,拟推进我国电子封装与组装的无铅化进程。
JIS Z 3198 is an industry standard about test method for lead-free solders and their joints.This standard was proposed initially by Welding Society of Japan,and reviewed by Council of Japan Industry Standard. Finally,the standard was determined by Japan Industry and Economy Ministry and released at 20 June,2003.The standard consists of seven sections such as test method for melting temperature range of lead-free solders,test method for mechanical properties,test method for spreading characteristics,test method for wetting characteristics,test method for tensile and shear strength of solder joints, test method for tensile properties of QFP solder joints,and test method for shear properties of solder joints of sliced devices.Present the contents of every section of the standard according to the original JIS Z 3198 1-7.The purpose is to improve the lead-free process in electronic package and assembly in China.
出处
《电子工艺技术》
2004年第2期47-54,共8页
Electronics Process Technology
关键词
无铅钎料
标准
接头性能
Lead-free solder
Standard
Performance of joint
