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多孔硅外延转移技术制备以氮化硅为绝缘埋层的SOI新结构 被引量:2

Fabrication of Silicon-on-Insulator Structure with Si_3N_4 as Buried Insulating Films by Epitaxial Layer Transfer
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摘要 为减少自加热效应 ,利用多孔硅外延转移技术成功地制备出一种以氮化硅为埋层的 SOI新结构 .高分辨率透射电镜和扩展电阻测试结果表明得到的 SOI新结构具有很好的结构和电学性能 ,退火后的氮化硅埋层为非晶结构 . The single crystalline Si/Si 3N 4/substrate Si structures are successfully formed using electron beam evaporation of silicon on porous silicon and epitaxial layer transfer.The SOI structures are investigated by high resolution cross sectional transmission electron microscopy (XTEM) and spreading resistance profile (SRP). Experimental results show the buried Si 3N 4 layer is amorphous structure and the new SOI sample has good structural and electrical properties.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2003年第2期189-193,共5页 半导体学报(英文版)
基金 国家重点基础研究专项经费 (No.G2 0 0 0 0 3 65 ) 国家自然科学基金 (批准号 :699760 3 4)资助项目 ~~
关键词 绝缘埋层 氮化硅薄膜 SOI结构 多孔硅外延转移 Si 3N 4 films SOI epitaxial layer transfer
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参考文献6

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同被引文献23

  • 1尹民,楼立人,张学兵,郭常新,徐叙瑢.常压MOCVD法在多孔硅上生长GaAs[J].中国科学技术大学学报,1996,26(3):284-288. 被引量:1
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