摘要
The APG-Cu-PCM structure has demonstrated significant thermal performance advantages over the traditional Cu-PCM structure.This study investigates the effects of APG thickness,area,and their coupling on heat dissipation performance through experiments and numerical simulations.Results show that increasing the APG area enhances heat dissipation by leveraging its high in-plane thermal conductivity,but an excessively large area leads to diminishing returns due to underutilization of peripheral regions.Similarly,increasing APG thickness improves thermal uniformity and slightly reduces chip temperatures.An optimal APG area is identified,where further area increases result in less than a 10%reduction in chip temperature.Additionally,an empirical formula linking APG area and thickness is derived using MATLAB curve fitting,providing a practical reference for designing APG-Cu-PCM structures.The study confirms that the APG-Cu-PCM structure achieves superior heat dissipation,maintaining lower chip temperatures and ensuring effective thermal management.These findings offer valuable insights for optimizing the thermal design of high-power electronic systems.
基金
supported by the National Natural Science Foundation of China(No.52276084).
