摘要
电解铜箔是一种电子产品与新能源电池的载体与导电材料,目前正朝着超薄、超厚、高频、高速等几个方面多维度发展,在其生产过程中有多个环节会用到去离子水清洗箔面。在气体与营养物质充足的前提下,环境温度达到37℃,pH达到7~8时,清洗水中会滋生大量细菌,细菌在管路中长时间滞留,会在管路内壁形成黏泥,堵塞过滤器与洗箔喷嘴的同时还会在铜箔表面形成斑点。细菌在箔面残留不仅会对铜箔外观产生影响,还会影响其抗剥离性能。借助扫描电镜与能谱分析手段对细菌的微观结构与成分进行了分析,并总结出物理杀菌、化学杀菌、优化管路走向、清洗末端管路等一系列措施来防控细菌的大量滋生,降低细菌过度繁殖对产品质量造成的影响,这对提高产品质量稳定性与企业品牌影响力有重大意义。
Electrolytic copper foil is a carrier and conductive material for electronic products and new energy batteries.At present,it is developing in multiple dimensions such as ultra-thin,ultra thick,high-frequency,and high-speed.During its production process,there are multiple aspects of deionizedwater used to clean the foil surface.On the premise of sufficient gas and nutrients,when the ambient temperature reaches 37℃and the pH reaches 7~8,a large number of bacteria will grow in the cleaning water.Bacteria remain in the pipeline for a long time,slime produced by bacteria adheres to the inner wall of the pipeline,not only blocking the filter and the foil washing nozzle,but also forming spots on the surface of the copper foil.The residue of bacteria on the foil surface not only affects the appearance of copper foil,but also affects its peel resistance.The micro structure and composition of bacteria were analyzed using a scanning electron microscope and energy spectrum analysis.A series of measures,such as physical sterilization,chemical sterilization,optimizing the pipeline direction,cleaning the end pipeline,and so on,are summarized to prevent and control a large number of bacteria,reducing the impact of bacterial overgrowth on product quality,improving product quality stability,and enhancing corporate brand influence are of great significance.
作者
李洋
李觉林
蒋少华
刘涛
高忠强
LI Yang;LI Juelin;JIANG Shaohua;LIU Tao;GAO Zhongqiang(Jiangxi JCC Copper Foil Technology Co.,Ltd.,Nanchang Jiangxi 330096,China)
出处
《江西化工》
2025年第4期6-9,15,共5页
Jiangxi Chemical Industry
关键词
电解铜箔
清洗水
细菌
危害
防控措施
electrolytic copper foil
clean water
bacteria
harm
prevention and control measures
