摘要
用俄歇电子能谱(AES),电子探针(BPM),扫描电镜(SEM),金相等技术分析了两种工业纯铜。分析结果表明,氧,铅杂质元素在铜内析出的脆性相是造成此类工业纯铜加工脆性的主要原因。
Two commercially pure coppers were examined by means of Auger electronspec-troscope, electron probe microscope, scanning electron microscope, and optical microscope. It is shown that the troublesome of brittles of the two coppers during deformatton is due to the brittle phasees of tmpurtties of oxygen and lead in copper .
出处
《上海钢研》
2002年第1期12-15,共4页
Journal of Shanghai Iron and Steel Research
