摘要
以纯铜为研究对象,通过添加镍粉进行表面机械研磨(SMAT)处理。用光学显微镜(OM)、X射线衍射分析仪(XRD)和扫描电镜(SEM)对SMAT处理后样品的组织及成分变化进行分析。采用X射线能量色散谱分析方法(EDS)分析Ni元素在合金层中的分布与含量。结果表明,纯铜表面出现了明显的分层现象,同时铜镍发生互扩散有铜镍合金形成。处理120 min后形成厚度为35μm铜镍合金层,而240 min厚度则达到55μm,并且合金层与基体变形层结合紧密。由于弹丸的冲击产生应力应变和大量储存能,使得原子的跳动频率增加同时降低了扩散激活能,实现铜镍在较低温度下快速互扩散。
CuNi alloy layers were prepared on the surface of pure copper matrix surrounded by nickel powder by surface mechanical attrition treatment（SMAT）. The composition distribution and microstructure of the alloy layers were characterized by means of optical microscope （OM） ,X-ray diffraction （XRD） and scanning electron microscopy （SEM）. The concentration variation of nickel element along the depth of the alloy layer was examined by using X-ray energy dispersive spectrum （EDS）. The results show that after SMAT treatment CuNi alloy layer appeared which resulted from mutual diffusion between copper atoms and nickel atoms, which contributed to delamination. The CuNi layer thickness is 35 p.m and 55μm after SMAT treatment for 120 min and 240 min, respectively, combining with matrix deformation layer closely. Due to rising stress, vacancy defects and storage energy after SMAT treatment, the higher atomic jumping frequency and lower activation energy of diffusion between copper and nickel can happen at low temperature.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2014年第1期175-180,共6页
Transactions of Materials and Heat Treatment
基金
国家自然科学基金(51001079、51374151)
高等学校博士点专项科研基金(20091402110010)
教育部中国博士后科学基金(20100471586)
山西省高等学校青年学术带头人支持计划
山西省自然科学基金(2011011020-2,2010021023-1)
关键词
纯铜
表面机械研磨
镍
合金层
pure copper
surface mechanical attrition treatment
nickel
alloy layer
