摘要
在不同升温速率下采用非等温差示扫描量热(DSC)技术对一种新型改性环氧树脂胶粘剂的固化反应过程进行了跟踪,并利用Kissinger、Crane方程以及Arrhenius方程对该固化反应进行了动力学分析。结果表明,该固化反应的活化能为59.18kJ/mol,反应级数为0.89;结合DSC谱图确定其固化工艺为130℃/1h+150℃/2h+175℃/3h。
The curing process of a novel modified epoxy resin adhesive systems was in detail studied by non-isothermal differential scanning calorimeter （ DSC ） technique, and kinetics of the curing process was analyzed by Kissinger,Crane and Arrhenius equations.The results showed that the apparent activation energy of the curing reaction is 59.18 kJ/mol, and the reaction order is 0.89.With the dynamical DSC spectrum of the epoxy resin adhesive, the curing process of the epoxy resin adhesive systems was determined as 130 ℃/1 h＋150 ℃/2 h＋175℃/3 h.
出处
《粘接》
CAS
2009年第8期43-45,共3页
Adhesion
