摘要
针对本所产品中多层陶瓷电容器(MLCC)在经过环境试验后出现的失效问题,通过对失效原因进行分析,结合生产实际情况,进行了技术改进。制作了技术改进前后的试验板,经过环境试验后测试,结果表明,未改进前的试验板中的MLCC出现问题,而改进后的试验板没有发现问题。最后对故障MLCC进行了DPA检查,结果发现MLCC端头出现45°角裂纹。试验结果表明经过技术改进后有效地解决了MLCC装配质量问题,提高了产品装配合格率,达到了预期的效果。
Aimed at the problems like MLCC failure after environment experiment, improve assembly technique through analyze MLCC failure reasons and manufacture practice . Make some samples for environment experiment. Some failures of MLCCs in former samples. However, all optimization samples are OK. Finally DPA check is made for failure MLCCs, find crack of 45 degree angle in MLCC end. These method are proved to effectively solve MLCC assembly problem through technique optimization.
出处
《电子工艺技术》
2008年第6期319-323,共5页
Electronics Process Technology
