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基于HP VEE的超声波塑料焊接温度场检测系统

A temperature field measuring system for ultrasonic plastic welding based on HP VEE
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摘要 由于超声波塑料焊接具有升温速度快、局部生热、压力作用的特点使其温度场测量非常困难。文中采用基于HP VEE的温度场测量系统来测量超声波塑料焊接的温度场;并介绍了HPVEE的功能、该温度场测量系统的组成和采用该系统进行的超声波焊接PVC塑料的温度场检测试验。试验表明该系统能够高精度、快速、自动的检测超声波塑料焊接温度场。 The temperature field measurement to ultrasonic plastic welding is very difficult in that the temperature rising speed is high and the welded area lies in a closed condition where pressure and heat develope rapidly through welding. This article presents a temperature field measuring system based on HP VEE, Which is used to measure the temperature of the ultrasonic plastic welding. The paper also describes the function of the HP VEE and the system structure as well as the temperature measurement of the ultrasonic PVC plastic weld- ing. The experimental results show that the measurement system is an accurate, fast and automatic system, which can be applied to the temperature measurement of ultrasonic plastic welding.
出处 《工业仪表与自动化装置》 2006年第1期31-32,56,共3页 Industrial Instrumentation & Automation
基金 湖北省教委科研计划资助项目(99C110) 三峡大学青年基金项目(KJA0314)
关键词 HP VEE 温度场 检测 超声波 塑料焊接 HP VEE temperature field measurement ultrasonic plastic welding
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