摘要
ＦＥＡ器件的性能由于半导体工艺水平和微机械加工技术的发展有了很大地提高。而其稳定和可靠性的研究是走向实用的必经过程。本文分析了温度、电压等因素对ＦＥＡ器件稳定和可靠性的影响。并研究了尖端发射表面功函数Φ、尖端发射面积Ｓ和尖端表面场强Ｅ与器件稳定性和可靠性的关系。
With the development of semiconductor process and micromechine technique,much progress has been made on the FEA davice recently.The research on its stability and reliability is the needful porcedure to practical use.In our paper,the influence of temperature and voltage on FEA device’s stability and reliiability has been discussed,and we have also studied the relationship between emission surface work function Φ,emission area S,emission field E and FFA’s stability,reliability.
出处
《电子器件》
CAS
1994年第3期22-24,共3页
Chinese Journal of Electron Devices
基金
国家自然科学基金
